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Packaging Engineer, Senior/Staff

Company: Qualcomm
Location: Santa Clara
Posted on: June 24, 2022

Job Description:


Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:

Qualcomm invents foundational technologies that transform how the world connects, computes and communicates. We've built on our legacy of developing breakthroughs in 5G, Wi-Fi and AI. But that's just the beginning. We then designed platforms, chipsets, software, tools and services that help OEMs and developers bring those technologies into products and create experiences that change the way we live and work. And, we do this at scale-building technologically advanced, in-demand end products across a range of industries-from automotive to virtual reality, from smart cars to smartphones to smart cities, and everything in between.

Job Overview:

Qualcomm Packaging group is responsible for developing new semiconductor/microelectronic package technologies and high-volume manufacturing deployment for different product segments for mobile market & new emerging markets. This team is responsible for road mapping, working with OSATs, suppliers and partners, internal design and product teams.

Job Responsibilities:

* Responsible for defining semiconductor/microelectronic package process flow, material set, test vehicle, DOEs, process control plans to successfully develop manufacturable and reliable packages such as Flip-Chip, Wirebond, SIP (System in Package)
* Lead root cause analysis for package and process failures and drive corrective action and mitigation
* Interface with OSATs, substrate suppliers, material/tool vendors in developing technology related to product requirements.
* Work with internal design and products teams and drive DFM methodology for new technologies.
* Work independently and/or with internal/external teams to develop and enable high performance and low-cost packaging solutions
* Technical program management to plan, execute, and monitor complex process or product developments. Communicate effectively with regular updates to management and stakeholders

Minimum Qualifications:

Required: Bachelor's, Electrical Engineering and/or Materials Science and/or Mechanical Engineering + 3 years of experience working in semiconductor packaging. Deep process experience in key packaging areas - wafer processing, flipchip, wirebond, underfill, molding, SMT, EMI shielding, SIP/modules and other packaging technologies.

Preferred Qualifications

* Masters/PhD in related areas
* Process integration experience in taking semiconductor packaging products from development to HVM.
* Familiar with substrate manufacturing and design rules
* Understanding effects of packaging material/structure on product electrical & thermal performance
* JEDEC standard component & board level reliability testing.

Qualcomm is committed to hiring and supporting individuals with disabilities. Although this role has some expected physical activity, an inability to perform one or more of the listed physical requirements should not deter otherwise qualified applicants from applying. We will work with you throughout the application and onboarding process to provide reasonable accommodations. Examples of expected physical activity include: frequently transporting between offices, buildings, and campuses up to - mile; frequently transporting and installing equipment up to 5 lbs.; performing tasks at various heights (e.g., standing or sitting); monitoring and utilizing computers and test equipment for more than 6 hours a day; and continuous communication which includes the comprehension of information with colleagues, customers, and vendors both in person and remotely.

Applicants: If you are an individual with a disability and need an accommodation during the application/hiring process, please call Qualcomm's toll-free number found here for assistance. Qualcomm will provide reasonable accommodations, upon request, to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. Qualcomm is an equal opportunity employer and supports workforce diversity.

To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

If you would like more information about this role, please contact Qualcomm Careers.

Keywords: Qualcomm, Santa Clara , Packaging Engineer, Senior/Staff, Engineering , Santa Clara, California

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