Packaging Engineer, Senior/Staff
Location: Santa Clara
Posted on: June 24, 2022
Qualcomm Technologies, Inc.
Engineering Group, Engineering Group > Packaging Engineering
Qualcomm invents foundational technologies that transform how the
world connects, computes and communicates. We've built on our
legacy of developing breakthroughs in 5G, Wi-Fi and AI. But that's
just the beginning. We then designed platforms, chipsets, software,
tools and services that help OEMs and developers bring those
technologies into products and create experiences that change the
way we live and work. And, we do this at scale-building
technologically advanced, in-demand end products across a range of
industries-from automotive to virtual reality, from smart cars to
smartphones to smart cities, and everything in between.
Qualcomm Packaging group is responsible for developing new
semiconductor/microelectronic package technologies and high-volume
manufacturing deployment for different product segments for mobile
market & new emerging markets. This team is responsible for road
mapping, working with OSATs, suppliers and partners, internal
design and product teams.
* Responsible for defining semiconductor/microelectronic package
process flow, material set, test vehicle, DOEs, process control
plans to successfully develop manufacturable and reliable packages
such as Flip-Chip, Wirebond, SIP (System in Package)
* Lead root cause analysis for package and process failures and
drive corrective action and mitigation
* Interface with OSATs, substrate suppliers, material/tool vendors
in developing technology related to product requirements.
* Work with internal design and products teams and drive DFM
methodology for new technologies.
* Work independently and/or with internal/external teams to develop
and enable high performance and low-cost packaging solutions
* Technical program management to plan, execute, and monitor
complex process or product developments. Communicate effectively
with regular updates to management and stakeholders
Required: Bachelor's, Electrical Engineering and/or Materials
Science and/or Mechanical Engineering + 3 years of experience
working in semiconductor packaging. Deep process experience in key
packaging areas - wafer processing, flipchip, wirebond, underfill,
molding, SMT, EMI shielding, SIP/modules and other packaging
* Masters/PhD in related areas
* Process integration experience in taking semiconductor packaging
products from development to HVM.
* Familiar with substrate manufacturing and design rules
* Understanding effects of packaging material/structure on product
electrical & thermal performance
* JEDEC standard component & board level reliability testing.
Qualcomm is committed to hiring and supporting individuals with
disabilities. Although this role has some expected physical
activity, an inability to perform one or more of the listed
physical requirements should not deter otherwise qualified
applicants from applying. We will work with you throughout the
application and onboarding process to provide reasonable
accommodations. Examples of expected physical activity include:
frequently transporting between offices, buildings, and campuses up
to - mile; frequently transporting and installing equipment up to 5
lbs.; performing tasks at various heights (e.g., standing or
sitting); monitoring and utilizing computers and test equipment for
more than 6 hours a day; and continuous communication which
includes the comprehension of information with colleagues,
customers, and vendors both in person and remotely.
Applicants: If you are an individual with a disability and need an
accommodation during the application/hiring process, please call
Qualcomm's toll-free number found here for assistance. Qualcomm
will provide reasonable accommodations, upon request, to support
individuals with disabilities to be able participate in the hiring
process. Qualcomm is also committed to making our workplace
accessible for individuals with disabilities. Qualcomm is an equal
opportunity employer and supports workforce diversity.
To all Staffing and Recruiting Agencies: Our Careers Site is only
for individuals seeking a job at Qualcomm. Staffing and recruiting
agencies and individuals being represented by an agency are not
authorized to use this site or to submit profiles, applications or
resumes, and any such submissions will be considered unsolicited.
Qualcomm does not accept unsolicited resumes or applications from
agencies. Please do not forward resumes to our jobs alias, Qualcomm
employees or any other company location. Qualcomm is not
responsible for any fees related to unsolicited
EEO Employer: Qualcomm is an equal opportunity employer; all
qualified applicants will receive consideration for employment
without regard to race, color, religion, sex, sexual orientation,
gender identity, national origin, disability, Veteran status, or
any other protected classification.
If you would like more information about this role, please contact
Keywords: Qualcomm, Santa Clara , Packaging Engineer, Senior/Staff, Engineering , Santa Clara, California
Didn't find what you're looking for? Search again!