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Manager - Advanced Packaging, Assembly and Test

Company: Celestial AI
Location: Santa Clara
Posted on: June 22, 2022

Job Description:

Job Description: In this role you will utilize your broad semiconductor packaging experience and partner management experience to drive company's Orion AI accelerator products from concept to high volume manufacturing. You will be responsible for driving engineering activities with multiple engineering groups, such as ASIC, AMS, Photonics and external partners to ensure design for manufacturing, reliability, and cost. Responsibilities will include identification and mitigation of risk to new technologies used in product integration and ensure factory readiness through maturing product during the NPI phase. This job will require you to have strong project management, written and verbal communication skills as well as a can-do attitude to prioritize and address issues with a high sense of urgency.
ESSENTIAL DUTIES AND RESPONSIBILITIES:

  • Work with cross-functional teams and lead package integration and architecture efforts with vendors
  • Work with small to large scale 3rd party vendors, foundries and OSATs to bring packaging solutions from concept to prototypes and ramp to high volume manufacturing with aggressive cost reduction strategies.
  • Actively manage qualification of package and board level assembly with sensitivity to physics of failures for high thermo-mechanical reliability, while operating within established cost constraints
  • Manage internal and external resources effectively and efficiently for thermal/mechanical/electrical simulations and package layouts
  • Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts by Celestial AI QUALIFICATIONS:
    • 5+ years of experience in Semiconductor Packaging Design, Process and/or Technology Development
    • Expertise in advanced packaging technologies: knowledge and insight to deliver high density/high performance interconnects in various 2.5D/3D package form factors
    • Good understanding of cross-functional packaging areas: Si floor plan, package and board level layout and architecture, design rules, BOM, enabling material/process technologies, thermal, mechanical, Signal/Power Integrity, design for manufacturing, reliability, and cost
    • Familiarity with component & system level reliability, testing, and FA
    • Experience with photonics packaging is a plus but not necessary
    • Experience in project management and communicating technical and project/program status and issue resolution at the executive level
    • Excellent problem-solving skills with strong fundamentals in science, sound engineering judgment, and analytical ability
    • Effective communicator and comfortable engaging withinternal cross functional teams as well as domestic and overseas suppliers
    • Excellent attention to detail, process and operationally oriented and self-driven with the ability to work independently and take projects to completion with minimum supervision
    • M.S or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science or Physics is required Location: Bay area location is preferred. We offer great benefits (health, vision, dental and life insurance), collaborative and continuous learning work environment, where you will get a chance to work with smart and dedicated people engaged in developing the next generation architecture for high performance computing.
      Celestial AI Inc. is proud to be an equal opportunity workplace and is an affirmative action employer.

Keywords: Celestial AI, Santa Clara , Manager - Advanced Packaging, Assembly and Test, Executive , Santa Clara, California

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