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TCAD Engineer

Company: Intel Corp.
Location: Santa Clara
Posted on: June 12, 2021

Job Description:

TCAD Engineer

Job Description

Group Information This position is associated with the sale of Intel's NAND memory and storage business to SK Hynix (You can read more about the transaction in the press release - https://newsroom.intel.com/wp-content/uploads/sites/11/2020/10/nand-memory-news-q-a.pdf). The transaction will enhance the resources and potential of the business' storage solutions, including client and enterprise SSDs, in the rapidly growing NAND Flash space amid the era of big data. This is an exciting time to be at Intel - come join our TCAD Team and work on one of the most advanced 3DNAND and SSD technology portfolios in the world. As the global leader in the semiconductor industry, Intel possesses many industry-leading SSD technologies including the most capable Quadruple Level Cell (QLC) NAND Flash products. In this role, you will be part of a world-class team that will transition to lead the SSD business at SK Hynix. This position aligns to Phase 2 of the transaction, which includes NAND technology and component development along with fab operations. Employees aligned to Phase 2 will continue to be employed by Intel and will continue to develop NAND technology and components and manufacture NAND wafers at the fab. Phase 2 of the transaction is expected to close in March 2025, at which time employees aligned to this phase of the transaction will transition employment to SK Hynix. Job Description This is an exciting opportunity to work on the latest breakthrough in Non-Volatile Memory Technology. You will be working in a dynamic team environment that develops and applies physics- and chemistry-based modeling tools - from molecular to device level - for simulating the creation and behavior of new materials, microelectronic devices, and structures used in 3D-NAND technology. Specific duties may include development of advanced SW and applications involving numerical device and process modeling, materials modeling, thermos-mechanical modeling, equipment modeling and/or geometry and meshing infrastructure. Areas of expertise that are applicable to this position are listed in bullet form below. A given project may combine one or more of these areas: Device: advanced device transport, quantum effects, electronic structure, novel device and memory operation, optoelectronics, mesh generation, software architecture and numerical methods for device problems. Process: Defect-coupled diffusion/activation, FEM based stress simulation, Software architecture, Numerical methods for process problems. Materials modeling: computational materials science including density functional theory and molecular dynamics modeling for front end or back end materials and processes. Thermo-mechanical: Advanced mechanical and material engineering background, heat transfer model from macro-scale to nano-scale transport, thermal induced stress/strain analysis, Finite element model development experience, reliability and material fatigue/failure research. Equipment: Gas and liquid phase transport phenomena, chemistry and chemical mechanism analysis, numerical methods for chemistry/fluid-flow/species-transport/heat-transfer, parallel programming, and semiconductor processing. Meshing: computational geometry, mesh generation algorithms, graph theory, computer graphics, scientific visualization, and parallel programming.

Qualifications

You must have a M.S / Ph.D. in Electrical Engineering, Chemical Engineering, Chemistry, Materials Science, Computer Science, Mechanical Engineering, or a related field. 5-7 years of experience in modeling semiconductor device, process, materials chemistry, feature scale, equipment, thermo-mechanical modeling physics or in advanced meshing or geometry. Leadership/ Managerial Exp preferred. 3+ years of experience programming in C/C++ for development positions. 2+ years of experience with scripting such as Python or equivalent desirable

Inside this Business Group

Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

Other Locations

US, California, Folsom

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

USExperienced HireJR0166548Santa Clara

Keywords: Intel Corp., Santa Clara , TCAD Engineer, Other , Santa Clara, California

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